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general description the MAX16010?ax16014 is a family of ultra-small, low- power, overvoltage protection circuits for high-voltage, high-transient systems such as those found in automotive, telecom, and industrial applications. these devices oper- ate over a wide 5.5v to 72v supply voltage range, making them also suitable for other applications such as battery stacks, notebook computers, and servers. the MAX16010 and max16011 offer two independent comparators for monitoring both undervoltage and overvoltage conditions. these comparators offer open- drain outputs capable of handling voltages up to 72v. the MAX16010 features complementary enable inputs (en/ en ), while the max16011 features an active-high enable input and a selectable active-high/low outb output. the max16012 offers a single comparator and an inde- pendent reference output. the reference output can be directly connected to either the inverting or noninverting input to select the comparator output logic. the max16013 and max16014 are overvoltage protec- tion circuits that are capable of driving two p-channel mosfets to prevent reverse-battery and overvoltage conditions. one mosfet (p1) eliminates the need for external diodes, thus minimizing the input voltage drop. the second mosfet (p2) isolates the load or regulates the output voltage during an overvoltage condition. the max16014 keeps the mosfet (p2) latched off until the input power is cycled. the MAX16010 and max16011 are available in small 8-pin tdfn packages, while the max16012/max16013/ max16014 are available in small 6-pin tdfn packages. these devices are fully specified from -40? to +125?. applications automotive industrial 48v telecom/server/networking firewire notebook computers multicell battery-stack powered equipment features ? wide 5.5v to 72v supply voltage range ? open-drain outputs up to 72v (MAX16010/max16011/max16012) ? fast 2? (max) propagation delay ? internal undervoltage lockout ? p-channel mosfet latches off after an overvoltage condition (max16014) ? adjustable overvoltage threshold ? -40? to +125? operating temperature range ? small 3mm x 3mm tdfn package MAX16010?ax16014 ultra-small, overvoltage protection/ detection circuits ________________________________________________________________ maxim integrated products 1 ordering information max16013 max16014 gate1 set gate2 v cc gnd p1 r1 r2 v batt p2 2m ? * *optional typical operating circuit 19-3693; rev 2; 1/07 for pricing, delivery, and ordering information, please contact maxim/dallas direct! at 1-888-629-4642, or visit maxim? website at www.maxim-ic.com. note: replace the ??with ??for 0.5% hysteresis, ??for 5% hysteresis, and ??for 7.5% hysteresis. firewire is a registered trademark of apple computer, inc. pin configurations appear at end of data sheet. part* temp range pin- package pkg codes MAX16010 ta_-t -40? to +125? 8 tdfn-ep** t833-2 max16011 ta_-t -40? to +125? 8 tdfn-ep** t833-2 max16012 tt-t -40? to +125? 6 tdfn-ep** t633-2 max16013 tt-t -40? to +125? 6 tdfn-ep** t633-2 max16014 tt-t -40? to +125? 6 tdfn-ep** t633-2 * replace -t with +t for lead-free packages. ** ep = exposed pad.
MAX16010?ax16014 ultra-small, overvoltage protection/ detection circuits 2 _______________________________________________________________________________________ absolute maximum ratings electrical characteristics (v cc = 14v, t a = -40? to +125?, unless otherwise noted. typical values are at t a = +25?.) (note 1) stresses beyond those listed under ?bsolute maximum ratings?may cause permanent damage to the device. these are stress rating s only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specificatio ns is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. (all pins referenced to gnd, unless otherwise noted.) v cc .........................................................................-0.3v to +80v en, en , logic...........................................-0.3v to (v cc + 0.3v) ina+, inb-, in+, in-, ref, set ..............................-0.3v to +12v outa, outb, out.................................................-0.3v to +80v gate1, gate2 to v cc ...........................................-12v to +0.3v gate1, gate2...........................................-0.3v to (v cc + 0.3v) current sink/source (all pins) .............................................50ma continuous power dissipation (t a = +70?) 6-pin tdfn (derate 18.2mw/? above +70?) .........1455mw 8-pin tdfn (derate 18.2mw/? above +70?) .........1455mw operating temperature range .........................-40? to +125? maximum junction temperature .....................................+150? storage temperature range .............................-60? to +150? lead temperature (soldering, 10s) .................................+300? parameter symbol conditions min typ max units supply voltage range v cc 5.5 72.0 v v cc = 12v 20 30 input supply current i cc no load v cc = 48v 25 40 ? v cc undervoltage lockout v uvlo v cc rising, part enabled, v ina+ = 2v, outa deasserted (MAX16010/max16011), v in = 2v, v out deasserted (max16012), v set = 0v, gate2 = v clmp (max16013/ max16014) 4.75 5 5.25 v v th+ 1.215 1.245 1.265 0.5% hysteresis, MAX16010/max16011 1.21 1.223 1.26 5.0% hysteresis, MAX16010/max16011/ max16013/max16014 1.15 1.18 1.21 ina+/inb-/set threshold voltage v th- 7.5% hysteresis MAX16010/max16011 1.12 1.15 1.18 v MAX16010taa/max16011taa 0.5 MAX16010tab/max16011tab/ max16013/max16014 5.0 threshold-voltage hysteresis MAX16010tac/max16011tac 7.5 % set/in_ input current set/in_ = 2v -100 +100 na in_ operating voltage range 0 4 v startup response time t start v cc rising from 0 to 5.5v 100 ? in_ to out/set to gate2 propagation delay t prop in_/set rising from (v th - 100mv) to (v th + 100mv) or falling from (v th + 100mv) to (v th - 100mv) (no load) 2s v cc 5.5v, i sink = 3.2ma 0.4 v out_ output-voltage low v ol v cc 2.8v, i sink = 100? 0.4 v out_ leakage current i leak out_ = 72v 500 na
MAX16010?ax16014 ultra-small, overvoltage protection/ detection circuits _______________________________________________________________________________________ 3 electrical characteristics (continued) (v cc = 14v, t a = -40? to +125?, unless otherwise noted. typical values are at t a = +25?.) (note 1) parameter symbol conditions min typ max units v il 0.4 en/ en , logic input voltage v ih 1.4 v en/ en , logic input current 12a en/ en , logic pulse width 10 ? v cc to gate_ output low voltage i gate _ sink = 75?, i gate _ source = 1?, v cc = 14v 711v v cc to gate_ clamp voltage v cc = 24v 12 18 v max16012 reference output voltage v ref no load 1.275 1.3 1.320 v reference short-circuit current i short ref = gnd 100 ? sourcing, 0 i ref 1? 0.1 reference load regulation sinking, -1? i ref 0 0.1 mv/? input offset voltage v cm = 0 to 2v -12.5 +12.5 mv input offset current 3na input hysteresis 8mv common-mode voltage range cmvr 0 2.0 v common-mode rejection ratio cmrr dc 70 db comparator power-supply rejection ratio psrr max16012, dc 70 db note 1: 100% production tested at t a = +25? and t a = +125?. specifications at t a = -40? are guaranteed by design. typical operating characteristics (v in = 14v, t a = +25?, unless otherwise noted.) supply current vs. supply voltage MAX16010 toc01 supply voltage (v) supply current ( a) 65 55 45 35 25 15 15 20 25 30 35 40 10 575 max16013/max16014 set = gnd, en = v cc MAX16010/max16011 ina+ = inb- = gnd outputs enabled max16012 in+ = in- = gnd supply current vs. temperature MAX16010 toc02 temperature ( c) supply current ( a) 110 95 65 80 -10 5 20 35 50 -25 26.05 26.10 26.15 26.20 26.25 26.30 26.35 26.40 26.45 26.50 26.00 -40 125 max16013/max16014 set = gnd, en = v cc gate voltage vs. supply voltage MAX16010 toc03 supply voltage (v) gate voltage (v) 65 55 45 35 25 15 10 20 30 40 50 60 0 575 max16013/max16014 set = gnd, en = v cc v gate v cc - v gate
MAX16010?ax16014 ultra-small, overvoltage protection/ detection circuits 4 _______________________________________________________________________________________ typical operating characteristics (continued) (v in = 14v, t a = +25?, unless otherwise noted.) uvlo threshold vs. temperature MAX16010 toc04 temperature ( c) uvlo threshold (v) 110 95 65 80 -10 5 20 35 50 -25 4.6 4.7 4.8 4.9 5.0 5.1 5.2 5.3 5.4 5.5 4.5 -40 125 ina+/inb-/set = gnd en = v cc rising falling ina+/inb-/set threshold vs. temperature MAX16010 toc05 temperature ( c) ina+/inb-/set threshold (v) 110 95 65 80 -10 5 20 35 50 -25 1.21 1.22 1.23 1.24 1.25 1.26 1.27 1.28 1.29 1.30 1.20 -40 125 ina+/inb-/set rising en = v cc gate voltage vs. temperature MAX16010 toc06 temperature ( c) (v cc - v gate ) (v) 110 95 65 80 -10 5 20 35 50 -25 9.1 9.2 9.3 9.4 9.5 9.6 9.7 9.8 9.9 10.0 9.0 -40 125 max16013/max16014 set = gnd, en = v cc startup waveform (r out = 100 ? , c in = 10 f, c out = 10nf) MAX16010 toc07 v gate 5v/div v out 10v/div v cc 10v/div 200 s/div startup waveform (r out = 100 ? , c in = 10 f, c out = 10nf) MAX16010 toc08 v gate 10v/div v out 10v/div v cc 1v/div 20 s/div v en = 0 to 2v overvoltage switch fault (r out = 100 ? , c in = 80 f, c out = 10nf) MAX16010 toc09 v gate 20v/div v out 20v/div v cc 20v/div 1ms/div v in = 12v to 40v, trip threshold = 28v overvoltage limit (r out = 100 ? , c in = 80 f, c out = 10nf) MAX16010 toc10 v gate 20v/div v out 20v/div v cc 20v/div 1ms/div v in = 12v to 40v trip threshold = 28v
MAX16010?ax16014 ultra-small, overvoltage protection/ detection circuits _______________________________________________________________________________________ 5 pin description pin MAX16010 max16011 max16012 max16013 max16014 name function 1 111 v cc positive-supply input voltage. connect v cc to a 5.5v to 72v supply. 2 2 2 2 gnd ground 3 en active-low enable input. drive en low to turn on the voltage detectors. drive en high to force the outa and outb outputs low. en is internally pulled up to v cc . connect en to gnd if not used. 4 4 outb open-drain monitor b output. connect a pullup resistor from outb to v cc . outb goes low when inb- exceeds v th+ and goes high when inb- drops below v th- (with logic connected to gnd for the max16011). drive logic high to reverse outb? logic state. outb is usually used as an overvoltage output. outb goes low (logic = low) or high (logic = high) when v cc drops below the uvlo threshold voltage. 5 5 inb- adjustable voltage monitor threshold input 6 65 en active-high enable input. for the MAX16010/max16011, drive en high to turn on the voltage detectors. drive en low to force outa low and outb low (logic = low) or high (logic = high). for the max16013/max16014, drive en high to enhance the p-channel mosfet (p2), and drive en low to turn off the mosfet. en is internally pulled down to gnd. connect en to v cc if not used. 7 7 outa open-drain monitor a output. connect a pullup resistor from outa to v cc . outa goes low when ina+ drops below v th- and goes high when ina+ exceeds v th+ . outa is usually used as an undervoltage output. outa also goes low when v cc drops below the uvlo threshold voltage. 8 8 ina+ adjustable voltage monitor threshold input 3 logic outb logic-select input. connect logic to gnd or v cc to configure the outb logic. see the max16011 output logic table. 3 out open-drain comparator output. connect a pullup resistor from out to v cc . out goes low when in+ drops below in-. out goes high when in+ exceeds in-. ? in- inverting comparator input 5 ref internal 1.30v reference output. connect ref to in+ for active-low output. connect ref to in- for active-high output. ref can source and sink up to 1?. leave ref floating if not used. ref output is stable with capacitive loads from 0 to 50pf. 6 in+ noninverting comparator input 3 gate2 gate-driver output. connect gate2 to the gate of an external p-channel mosfet pass switch. gate2 is driven low to the higher of v cc - 10v or gnd during normal operations and quickly shorted to v cc during an overvoltage condition (set above the internal threshold). gate2 is shorted to v cc when the supply voltage goes below the uvlo threshold voltage. gate2 is shorted to v cc when en is low. 4 set device overvoltage threshold adjustment input. connect set to an external resistive divider network to adjust the desired overvoltage disable or overvoltage limit threshold (see the typical application circuit and overvoltage limiter section). 6 gate1 gate-driver output. connect gate1 to the gate of an external p-channel mosfet to provide low drop reverse voltage protection. ep exposed pad. connect ep to gnd.
MAX16010?ax16014 detailed description the MAX16010?ax16014 is a family of ultra-small, low- power, overvoltage protection circuits for high-voltage, high-transient systems such as those found in automo- tive, telecom, and industrial applications. these devices operate over a wide 5.5v to 72v supply voltage range, making them also suitable for other applications such as battery stacks, notebook computers, and servers. the MAX16010 and max16011 offer two independent comparators for monitoring both undervoltage and overvoltage conditions. these comparators offer open- drain outputs capable of handling voltages up to 72v. the MAX16010 features complementary enable inputs (en/ en ), while the max16011 features an active-high enable input and a selectable active-high/low outb output. the max16012 offers a single comparator and an inde- pendent reference output. the reference output can be directly connected to either the inverting or noninvert- ing input to select the comparator output logic. the max16013 and max16014 are overvoltage protec- tion circuits that are capable of driving two p-channel mosfets to prevent reverse battery and overvoltage conditions. one mosfet (p1) eliminates the need for external diodes, thus minimizing the input voltage drop. while the second mosfet (p2) isolates the load or reg- ulates the output voltage during an overvoltage condi- tion. the max16014 keeps the mosfet (p2) latched off until the input power is cycled. voltage monitoring the MAX16010/max16011 include undervoltage and overvoltage comparators for window detection (see figure 1). out_ asserts high when the monitored volt- age is within the selected ?indow.?outb asserts low when the monitored voltage falls below the lower (v triplow ) limit of the window, or outa asserts low if the monitored voltage exceeds the upper limit (v triphigh ). the application in figure 1 shows out_ enabling the dc-dc converter when the monitored volt- age is in the selected window. the resistor values r1, r2, and r3 can be calculated as follows: where r total = r1 + r2 + r3. use the following steps to determine the values for r1, r2, and r3. 1) choose a value for r total , the sum of r1, r2, and r3. because the MAX16010/max16011 have very high input impedance, r total can be up to 5m ? . 2) calculate r3 based on r total and the desired upper trip point: 3) calculate r2 based on r total , r3, and the desired lower trip point: 4) calculate r1 based on r total , r3, and r2: r1 = r total - r2 - r3 the max16012 has both inputs of the comparator avail- able with an integrated 1.30v reference (ref). when the voltage at in+ is greater than the voltage at in- then out goes high. when the voltage at in- is greater than the voltage at in+ then out goes low. connect ref to in+ or in- to set the reference voltage value. use an external resistive divider to set the monitored voltage threshold. r vr v r th total triplow 23 = ? ? r vr v th total triphigh 3 = + vv r r triphigh th total = ? ? ? ? ? ? + 3 vv r rr triplow th total = + ? ? ? ? ? ? ? 23 ultra-small, overvoltage protection/ detection circuits 6 _______________________________________________________________________________________ MAX16010 dc-dc regulator in en ina+ inb- outb outa r3 r2 r1 +48v en gnd v cc en figure 1. MAX16010 monitor circuit
the max16013/max16014 can be configured as an overvoltage switch controller to turn on/off a load (see the typical application circuit ). when the programmed overvoltage threshold is tripped, the internal fast com- parator turns off the external p-channel mosfet (p2), pulling gate2 to v cc to disconnect the power source from the load. when the monitored voltage goes below the adjusted overvoltage threshold, the max16013 enhances gate2, reconnecting the load to the power source (toggle enable on the max16014 to reconnect the load). the max16013 can be configured as an overvoltage limiter switch by connecting the resistive divider to the load instead of v cc (figure 3). see the overvoltage limiter section. supply voltage connect a 5.5v to 72v supply to v cc for proper opera- tion. for noisy environments, bypass v cc to gnd with a 0.1? or greater capacitor. when v cc falls below the uvlo voltage the following states are present (table 1). hysteresis hysteresis adds noise immunity to the voltage monitors and prevents oscillation due to repeated triggering when the monitored voltage is near the threshold trip voltage. the hysteresis in a comparator creates two trip points: one for the rising input voltage (v th+ ) and one for the falling input voltage (v th- ). these thresholds are shown in figure 4. enable inputs (en or en ) the max16011 offers an active-high enable input (en), while the MAX16010 offers both an active-high enable input (en) and active-low enable input ( en ). for the MAX16010, drive en low or en high to force the output low. when the device is enabled (en = high and en = low) the state of outa and outb depends on ina+ and inb- logic states. MAX16010?ax16014 ultra-small, overvoltage protection/ detection circuits _______________________________________________________________________________________ 7 max16012 in+ ref in- out r pullup r1 r2 gnd v batt v cc out figure 2. typical operating circuit for the max16012 max16013 gate1 set gate2 v cc gnd p2 p1 r1 r2 v batt figure 3. overvoltage limiter protection table 1. uvlo state (v cc < v uvlo ) part outa outb out gate2 MAX16010 low low max16011 low low, logic = low high, logic = high max16012 low max16013 max16014 high v in+ v out v th+ v th- v cc 0v v hyst t prop t prop t prop figure 4. input and output waveforms
MAX16010?ax16014 for the max16011, drive en low to force outa low, outb low when logic = low, and outb high when logic = high. when the device is enabled (en = high) the state of outa and outb depends on the ina+, inb-, and logic input (see table 2). for the max16013/max16014, drive en low to pull gate2 to v cc , turning off the p-channel mosfet (p2). when the device is enabled (en = high), gate2 is pulled to the greater of (v cc - 10v) or gnd turning on the external mosfet (p2). applications information load dump most automotive applications are powered by a multi- cell, 12v lead-acid battery with a voltage between 9v and 16v (depending on load current, charging status, temperature, battery age, etc.). the battery voltage is distributed throughout the automobile and is locally regulated down to voltages required by the different system modules. load dump occurs when the alterna- tor is charging the battery and the battery becomes disconnected. power in the alternator inductance flows into the distributed power system and elevates the volt- age seen at each module. the voltage spikes have rise times typically greater than 5ms and decays within sev- eral hundred milliseconds but can extend out to 1s or more depending on the characteristics of the charging system. these transients are capable of destroying sensitive electronic equipment on the first fault event. the max16013/max16014 provide the ability to dis- connect the load from the charging system during an overvoltage condition to protect the module. in addi- tion, the max16013 can be configured in a voltage-lim- iting mode. this allows continuous operation while providing overvoltage protection. see the overvoltage limiter section. input transients clamping when the external mosfet is turned off during an overvoltage occurrence, stray inductance in the power path may cause voltage ringing to exceed the max16013/max16014 absolute maximum input (v cc ) supply rating. the following techniques are recom- mended to reduce the effect of transients: minimize stray inductance in the power path using wide traces, and minimize loop area including the power traces and the return ground path. add a zener diode or transient voltage suppresser (tvs) rated below v cc absolute maximum rating (figure 3). overvoltage limiter when operating in overvoltage-limiter mode, the max16013 drives the external p-channel mosfet (p2), resulting in the external mosfet operating as a voltage regulator. during normal operation, gate2 is pulled to the greater of (v cc - 10v) or gnd. the external mosfet? drain voltage is monitored through a resistor-divider between the p2 output and set. when the output voltage rises above the adjusted overvoltage threshold, an internal comparator pulls gate2 to v cc . when the monitored voltage goes below the overvoltage threshold, the p-channel mosfet (p2) is turned on again. this process continues to keep the voltage at the output reg- ulated to within approximately a 5% window. the output voltage is regulated during the overvoltage transients and the mosfet (p2) continues to conduct during the overvoltage event, operating in switched-linear mode. caution must be exercised when operating the max16013 in voltage-limiting mode for long durations due to the mosfet? power dissipation consideration (see the mosfet selection and operation section). mosfet selection and operation (max16013 and max16014) most battery-powered applications must include reverse voltage protection. many times this is implemented with a diode in series with the battery. the disadvantage in using a diode is the forward voltage drop of the diode, which reduces the operating voltage available to down- stream circuits (v load = v battery - v diode ). the max16013 and max16014 include high-voltage gate1 drive circuitry allowing users to replace the high-voltage- drop series diode with a low-voltage-drop mosfet device (as shown in the typical operating circuit and figure 3). the forward voltage drop is reduced to i load x r ds-on of p1. with a suitably chosen mosfet, the voltage drop can be reduced to millivolts. ultra-small, overvoltage protection/ detection circuits 8 _______________________________________________________________________________________ table 2. max16011 output logic logic ina+ inb- outa outb low > v th+ > v th+ high impedance low low < v th- < v th- low high impedance high > v th+ > v th+ high impedance high impedance high < v th- < v th- low low
in normal operating mode, internal gate1 output cir- cuitry enhances p1 to a 10v gate-to-source (v gs ) for 11v < v cc < 72v. the constant 10v enhancement ensures p1 operates in a low r ds-on mode, but the gate-source junction is not overstressed during high- battery-voltage application or transients (many mosfet devices specify a ?0v v gs absolute maximum). as v cc drops below 10v gate1 is limited to gnd, reduc- ing p1 v gs to v cc - gnd. in normal operation the p1 power dissipation is very low: p1 = i load 2 x r ds-on during reverse-battery applications, gate1 is limited to gnd and the p1 gate-source junction is reverse biased. p1 is turned off and neither the max16013/ max16014 nor the load circuitry is exposed to the reverse-battery voltage. care should be taken to place p1 (and its internal drain-to-source diode) in the correct orientation for proper reverse battery operation. p2 protects the load from input overvoltage conditions. during normal operating modes (the monitored voltage is below the adjusted overvoltage threshold), internal gate2 output circuitry enhances p2 to a 10v gate-to- source (v gs ) for 11v < v cc < 72v. the constant 10v enhancement ensures p2 operates in a low r ds-on mode but the gate-to-source junction is not over- stressed during high-battery-voltage applications (many pfet devices specify a ?0v v gs absolute max- imum). as v cc drops below 10v, gate2 is limited to gnd, reducing p2 v gs to v cc - gnd. in normal opera- tion, the p2 power dissipation is very low: p2 = i load 2 x r ds-on during overvoltage conditions, p2 is either turned com- pletely off (overvoltage-switch mode) or cycled off-on- off (voltage-limiter mode). care should be taken to place p2 (and its internal drain-to-source diode) in the correct orientation for proper overvoltage protection operation. during voltage-limiter mode, the drain of p2 is limited to the adjusted overvoltage threshold, while the battery (v cc ) voltage rises. during prolonged over- voltage events, p2 temperature can increase rapidly due to the high power dissipation. the power dissipat- ed by p2 is: p2 = v ds-p2 x i load = (v cc - v ov-adjusted ) x i load where v cc ~ v battery and v ov-adjusted is the desired load limit voltage. for prolonged overvoltage events with high p2 power dissipation, proper heatsinking is required. adding external pullup resistors it may be necessary to add an external resistor from v cc to gate1 to provide enough additional pullup capability when the gate1 input goes high. the gate_ output can only source up to 1? current. if the source current is less than 1?, no external resistor may be necessary. however, to improve the pullup capability of the gate_ output when it goes high, con- nect an external resistor between v cc and the gate_. the application shows a 2m ? resistor, which is large enough not to impact the sinking capability of the gate_ (during normal operation) while providing enough pullup during an overvoltage event. with an 11v (worst case) v cc -to-gate clamp voltage and a sinking current of 75?, the smallest resistor should be 11v/75?, or about 147k ? . however, since the gate_ is typically low most of the time, a higher value should be used to reduce overall power consumption. MAX16010?ax16014 ultra-small, overvoltage protection/ detection circuits _______________________________________________________________________________________ 9
MAX16010?ax16014 ultra-small, overvoltage protection/ detection circuits 10 ______________________________________________________________________________________ functional diagrams MAX16010 hyst hyst regulator enable circuitry 1.23v ~4v ina+ inb- outa outb gnd en en v cc figure 5. MAX16010 functional diagram max16011 hyst hyst regulator enable circuitry outb logic 1.23v ~4v ina+ inb- outa outb gnd en logic v cc figure 6. max16011 functional diagram max16012 regulator 1.30v ~4v in- out gnd v cc in+ ref figure 7. max16012 functional diagram max16013 max16014 hyst enable circuitry latch clear 1.23v set gnd en v cc gate1 gate2 figure 8. max16013/max16014 functional diagram
MAX16010?ax16014 ultra-small, overvoltage protection/ detection circuits ______________________________________________________________________________________ 11 chip information process: bicmos 8765 1234 ina+ outa en inb- v cc gnd en outb top view MAX16010 tdfn (3mm x 3mm) 8765 1234 ina+ outa en inb- v cc gnd logic outb max16011 tdfn (3mm x 3mm) 6 in+ 5 ref 4 in- 1 v cc 2 gnd 3 out max16012 tdfn (3mm x 3mm) 6 gate1 5 en 4 set 1 v cc 2 gnd 3 gate2 max16013 max16014 tdfn (3mm x 3mm) pin configurations
MAX16010?ax16014 ultra-small, overvoltage protection/ detection circuits maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a maxim product. no circu it patent licenses are implied. maxim reserves the right to change the circuitry and specifications without notice at any time. 12 ____________________maxim integrated products, 120 san gabriel drive, sunnyvale, ca 94086 408-737-7600 2007 maxim integrated products is a registered trademark of maxim integrated products, inc. 6, 8, &10l, dfn thin.eps h 1 2 21-0137 package outline, 6,8,10 & 14l, tdfn, exposed pad, 3x3x0.80 mm common dimensions symbol min. max. a 0.70 0.80 d 2.90 3.10 e 2.90 3.10 a1 0.00 0.05 l 0.20 0.40 pkg. code n d2 e2 e jedec spec b [(n/2)-1] x e package variations 0.25 min. k a2 0.20 ref. 2.300.10 1.500.10 6 t633-1 0.95 bsc mo229 / weea 1.90 ref 0.400.05 1.95 ref 0.300.05 0.65 bsc 2.300.10 8 t833-1 2.00 ref 0.250.05 0.50 bsc 2.300.10 10 t1033-1 2.40 ref 0.200.05 - - - - 0.40 bsc 1.700.10 2.300.10 14 t1433-1 1.500.10 1.500.10 mo229 / weec mo229 / weed-3 0.40 bsc - - - - 0.200.05 2.40 ref t1433-2 14 2.300.10 1.700.10 t633-2 6 1.500.10 2.300.10 0.95 bsc mo229 / weea 0.400.05 1.90 ref t833-2 8 1.500.10 2.300.10 0.65 bsc m o229 / weec 0.300.05 1.95 ref t833-3 8 1.500.10 2.300.10 0.65 bsc m o229 / weec 0.300.05 1.95 ref -drawing not to scale- h 2 2 21-0137 package outline, 6,8,10 & 14l, tdfn, exposed pad, 3x3x0.80 mm 2.300.10 mo229 / weed-3 2.00 ref 0.250.05 0.50 bsc 1.500.10 10 t1033-2 package information (the package drawing(s) in this data sheet may not reflect the most current specifications. for the latest package outline info rmation, go to www.maxim-ic.com/packages .) revision history pages changed at rev 2: 1, 10, 12

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